Processor module with thermal dissipation device

ABSTRACT

Embodiments include apparatus, methods, and systems of a processor module for a system board. An electronic module is removably connectable to a system board. The electronic module has first and second portions. The first portion is connected to the system board and includes a thermal dissipation device and a printed circuit board (PCB) with a processor connected to a first side of the PCB. The thermal dissipation device extends between the processor and the system board. The second portion connects on top of the first portion and has a power system board for providing power to the processor. The power system board extends adjacent and parallel to a second side of the PCB.

BACKGROUND

Some electronic systems utilize several printed circuit boards with manydifferent electronic components interconnected to the circuit boards. Asthese electronic systems decrease in size and increase in performance,packing density, heat dissipation, and power distribution architecturebecome increasingly important.

One way to increase packing density and reduce the actual size of anelectronic device is to more closely position the electrical componentstogether. Electrical components within a circuit board, however, aregenerally already tightly confined, and additional space may not bereadily available. If, however, electrical components can be positionedto reduce the overall size of the electronic device, then significantsavings and advantages can be realized.

As electrical components are more densely packed together and asperformance of these components increases, heat dissipation can become amore significant factor in many electronic systems. Circuit boards mayinclude a plurality of heat-generating devices that must be cooled inorder to operate within a specified operating temperature. If theseheat-generating devices are not sufficiently cooled, then the devicescan exhibit a decrease in performance or even permanently fail. Further,if the heat-generating devices are closely packed together, then heatfrom one device could affect the performance of an adjacent device.

The design and layout of printed circuit board components can be quitecomplex and challenging. Designers must consider many factors, such aspacking density and heat dissipation, to name a few examples.Improvements in these areas can realize significant benefits forelectronic systems and devices.

SUMMARY

Embodiments include apparatus, methods, and systems of a processormodule for a system board. An electronic module is removably connectableto a system board. The electronic module has first and second portions.The first portion is connected to the system board and includes athermal dissipation device and a printed circuit board (PCB) with aprocessor connected to a first side of the PCB. The thermal dissipationdevice extends between the processor and the system board. The secondportion connects on top of the first portion and has a power systemboard for providing power to the processor. The power system boardextends adjacent and parallel to a second side of the PCB.

In another exemplary embodiment, a method comprises connecting a firstportion of an electronic module to a printed circuit board (PCB), thefirst portion having a thermal dissipation device and a processor boardwith plural processors; connecting a second portion of the electronicmodule on top of the first portion so a power board in the secondportion is back-to-back with the processor board; and dissipating heataway from the plural processors with the thermal dissipation device.

Other embodiments and variations of these embodiments are shown andtaught in the accompanying drawings and detailed description.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an exploded side view of a block diagram of an electronicassembly in accordance with an exemplary embodiment of the presentinvention.

FIG. 2 is a side view of the electronic assembly of FIG. 1 with theelectronic assembly being assembled together.

FIG. 3 is an end view of FIG. 2.

FIG. 4 is a side view of an exemplary embodiment of an electronicassembly being assembled together.

FIG. 5 is an end view of FIG. 4.

FIG. 6A is an exemplary embodiment of a thermal dissipation device.

FIG. 6B is another exemplary embodiment of a thermal dissipation device.

FIG. 6C is another exemplary embodiment of a thermal dissipation device.

DETAILED DESCRIPTION

FIGS. 1-3 show an electronic system or assembly 100 in accordance withan exemplary embodiment of the present invention. The electronicassembly 100 includes two printed circuit boards (PCB) or printed wiringboards (PWB) 102 and 104. The PCBs 102 and 104 can have a variety ofconfigurations and still be within embodiments in accordance with theinvention. By way of example, the PCBs can include power module circuitboards, voltage regulation module (VRM) circuit boards, controllerboards (such as a special type of expansion board that contains acontroller for a peripheral device), expansion boards (such as any boardthat plugs into an expansion slot of a computer), or modules. As anotherexample, the PCB 102 can be a motherboard, and the PCB 104 can be adaughterboard.

A motherboard is a printed circuit board that can be used in a personalcomputer, server, or other electronic device. The motherboard (alsoknown as a main board or system board) can provide attachment points forprocessors, graphics cards, sound cards, controllers, memory, integratedcircuits (ICs), modules, PCBs, and many other electronic components anddevices in a computing system. The daughterboard can be utilized as anextension of the motherboard or other card or board. The daughterboardcan have plugs, sockets, pins, connectors, or other attachments for themotherboard or other boards. Connectors 106A and 106B, for example, canbe used to electrically couple the PCB 102 to the PCB 104. Connectors106 provide a mechanical and electrical interface or connection betweenthe PCBs and may include, for example, a removably connectable plug(male) and socket (female). Alternatively, a single connector can beused to connect the PCBs 102 and 104. Further, a connection mechanismbetween PCBs 102 and 104 can be located at various positions, such as,but not limited to, the sides and/or ends of the PCBs. Further yet,soldering can be used in place of or in conjunction with any connection.

The PCBs 102 and 104 include a plurality of electronic components ordevices. For example, the PCB 104 includes a plurality ofheat-generating components or devices 110. These heat-generating devicesinclude any electronic component that generates heat during operation.For example, heat-generating devices include, but are not limited to,electronic power circuits, integrated circuits (ICs) or chips, digitalmemory chips, application specific integrated circuits (ASICs),processors (such as a central processing unit (CPU) or digital signalprocessor (DSP)), discrete electronic devices (such as field effecttransistors (FETs)), other types of transistors, or devices that requireheat to be thermally dissipated from the device for the device tooperate properly or within a specified temperature range. An ASIC cancomprise an integrated circuit or chip that has functionality customizedfor a particular purpose or application. The PCBs 102 and 104 and/orpower system 130 can also include a plurality of electronic componentsor device that may or may not generate heat, that may generate low orinsignificant amounts of heat, or that may generate heat but not requirethe generated heat to be thermally dissipated from the device for thedevice to operate properly or within a specified temperature range.Examples of such devices include, but are not limited to, resistors,capacitors, transistors, diodes, memories, etc.

The electronic assembly 100 includes at least one thermal solution orthermal dissipation device 120A, and optionally includes a secondthermal dissipation device 120B. Thermal dissipation devices include,but are not limited to, heat spreaders, cold plates or thermal-stiffenerplates, refrigeration (evaporative cooling) plates, heat pipes,mechanical gap fillers (such as a plurality of rods, pins, etc.),thermal pads, or other devices adapted to dissipate heat. Further,thermal dissipation devices include thermal compounds and thermalinterface material that can be used to form a thermally conductive layeron a substrate, between electronic components, or within a finishedcomponent. For example, thermally conductive resins, tapes, moldedthermoplastic compounds, adhesives, gap pads, and greases can be usedbetween a heat-generating device and thermal dissipating device toimprove heat dissipation and/or heat transfer. Further, thermaldissipation devices include heatsinks. A heatsink is a componentdesigned to reduce the temperature of a heat-generating device orcomponent, such as heat-generating components 110. A heatsink, forexample, can dissipate heat in a direct or indirect heat exchange withthe electronic components, the heat being dissipated into surroundingair or surrounding environment. Numerous types of heatsinks can beutilized with embodiments in accordance with the present invention. Forexample, embodiments can include heatsinks without a fan (passiveheatsinks) or heatsinks with a fan (active heatsink). Other examples ofheatsinks include extruded heatsinks, folded fin heatsinks, cold-forgedheatsinks, bonded/fabricated heatsinks, and skived fin heatsinks.Further, the thermal dissipation device, including heatsinks, can useliquids or phase change material. For example, the thermal dissipationdevice can conduct heat from heat-generating devices to a heatsink thatis liquid or air cooled. Furthermore, liquid pipes or liquid loops canbe used to evacuate or transfer heat from the thermal dissipation deviceor module to an external location that is remote from the thermaldissipation device or module.

The electronic assembly 100 also includes at least one power supply orpower system 130. Electrical connectors or power coupling devices 140connect the respective power system 130 to the PCB 104. FIGS. 1-3 showone connector 140 located at each end or corner of the PCB 104 and/orpower system 130. Although two connectors 140 are shown, embodiments inaccordance with the invention are not limited to a particular number,type, or location of connectors. For example, a single connector ormultiple connectors can be used to couple the power system 130 to thePCB 104. Alternatively, the connectors can be located at variouspositions, such as, but not limited to, the sides, middle, and/or endsof the PCB 104 and/or power system 130.

The power system 130 can include numerous embodiments for providingpower to electronic components (such as heat-generating components 110)and/or PCBs (such as the PCB 104) within the electronic assembly 100.For example, the power system can be a factorized power architecture(FPA) module, a power converter, such as a direct current (DC) converteror DC-DC converter, DC linear regulator, AC-DC converter, DC switchingregulator, or DC charge pump.

The power system 130 can be configured as PCBs, power module assemblies,power circuit cards/boards, and/or power module PCBs. As shown in FIGS.1-3, the power system 130 is disposed in a parallel and verticallystacked-up relationship with the thermal dissipation devices 120A, 120Band PCBs 102 and 104. In one exemplary embodiment, the power system 130and PCB 104 are parallel and separated by a distance approximately equalto a thickness of connectors 140. As shown in FIG. 2, a small space 164exists between one surface of the power system 130 and one surface ofthe PCB 104. In one exemplary embodiment, this space 164 can be filledwith a thermally conductive gap filler.

The power system 130 may be modular and replaceable. In someembodiments, the power system 130 is an independently-operable unit ormodule that can be constructed with standardized units or dimensions forflexibility and replaceability for use in the electronic assembly 100.Further, the power system 130 can be connected to or removed from theelectronic assembly (example, the PCB 104) without connecting, removing,or replacing other components in the electronic assembly 100 (example,the heat-generating components 110, PCB 104, and/or thermal dissipationdevice 120A). As such, the power system 130 can be serviced (example,replaced or repaired) independently of the PCB 102 or the PCB 104 and/orheat generating components 110. By way of illustration, suppose forexample that power system 130 fails or otherwise needs to be replaced orupgraded. The power system 130 can be disconnected from the connectors140 and disconnected and removed from the PCB 104 without removing orreplacing the heat-generating components 110 and/or the PCBs 102 and104. Alternatively, if the thermal dissipation device 120B is utilized,it could be simultaneously removed with the power system 130 or removedbefore the power system 130 is removed.

The PCB 104 may be modular and replaceable. In some embodiments, the PCB104 is an independently-operable unit or module that can be constructedwith standardized units or dimensions for flexibility and replaceabilityfor use in the electronic assembly 100. Further, the PCB 104 can beconnected to or removed from the electronic assembly (example, the PCB102 and/or power system 130) without connecting, removing, or replacingother components in the electronic assembly 100. As such, the PCB 104can be serviced (example, replaced or repaired) independently of the PCB102 or the power system 130 and/or thermal dissipation device 120. Byway of illustration, suppose for example that the PCB 104 fails orotherwise needs replaced or upgraded. The PCB 104 can be disconnectedand removed from the PCB 102 and/or power system 130. Once the PCB 104is removed, heat-generating components 110 could, for example, berepaired or replaced, and the PCB 104 then re-attached or re-connectedto the PCB 102 and the power system 130.

Once connected, the PCB 104 is sandwiched between the PCB 102 and thepower system 130. Further, the PCBs 102 and 104 and power system 130 arespaced apart, parallel, and mechanically and electrically connected toform a vertical stacked-up configuration. As shown in FIGS. 1-3, theelectronic assembly 100 comprises at least three different verticallystacked layers, with each layer being separated from the other layers. Afirst or top layer includes the power system 130; a second or middlelayer includes the PCB 104; and a third or bottom layer includes the PCB102. The thermal dissipation device 120A is disposed between the secondand third layers and can, in some embodiments, form part of either thesecond layer or the third layer.

In one exemplary embodiment, the thermal dissipation device 120Asubstantially fills a volume of space that extends above a top surfaceof the heat-generating components 110 and that extends underneath thePCB 104 and above the PCB 102. As shown for example in FIGS. 1 and 2, aportion of the top side 166 of the thermal dissipation device 120Aextends along all of or substantially all of the surface area(length×width) of an underside 168 of the PCB 104. A bottom side 170 ofthe thermal dissipation device 120A extends along a top side 172 of PCB102.

In one exemplary embodiment, a bottom portion or bottom surface 174 ofthe thermal dissipation device 120B extends along all of orsubstantially all of a surface area (length×width) of a top side 176 ofpower system 130.

Although FIGS. 1-3 illustrate the PCB 104, power system 130, and thermaldissipation devices 120A, 120B as being one-piece, embodiments inaccordance with the invention are not limited to being one-piece,integrally formed, or the like. The PCB 104, power system 130, andthermal dissipation devices 120A, 120B can be formed as separate,distinct units or pieces that, for example, couple together or thatelectrically and/or mechanically communicate with each other.

The thermal dissipation devices 120A, 120B can directly or indirectlyattach to or contact with various layers and/or electrical components(such as the power system 130, the heat-generating components 110,and/or PCBs 102 and 104). For example, the thermal dissipation device120B can directly contact the power system 130 so as to directlytransfer or dissipate heat away from the power system. As anotherexample, the thermal dissipation device 120A can directly contact boththe heat generating components 110 and a portion of the surface of thePCB 102. Since the thermal dissipation device 120A is sandwiched betweenthe PCBs 102 and 104, heat can transfer directly from both the heatgenerating components 110 and the PCB 102 to the thermal dissipationdevice 120A.

Heat can be conducted, exchanged, and dissipated through or from plurallayers, devices, components, and/or modules in a variety of embodimentsin accordance with the invention. For illustrations purposes, some ofthese exemplary embodiments are discussed in connection with FIGS. 1-3.

As one example, heat can be evacuated or dissipated for a module orlayer from a common exit location or common surface area. Heat generatedfrom the power system 130 can be conducted or transferred through thethermal dissipation device 120B and thereafter dissipated into the airor environment at a top surface 178. As another example, as heat isgenerated from heat-generating components 110, the generated heat istransferred from a top surface of the heat-generating components 110and/or the PCBs 102 and 104 to the thermal dissipation device 120A. Inthis manner, the thermal dissipation device 120A can simultaneouslydissipate heat from the heat-generating components 110 and PCBs 102 and104.

Any surface (such as surface 178) of a thermal dissipation device can beenhanced to facilitate heat dissipate and/or heat exchange. For example,the surface can include fins, rods, pins, or other features. Furtheryet, any surface of any thermal dissipation device can be formed as aseparate body or unit that mounts to the body of the thermal dissipationdevice.

Heat can be dissipated from the thermal dissipation devices 120A and120B in a variety of ways. For example, one or both of the thermaldissipation devices 120A and 120B can be an active device that producesan airflow. For purposes of illustration only, the electronic assembly100 is shown with an airflow direction as indicated with arrows (theairflow being into the page and indicated with a circle and “X”). Theairflow can be provided, for example, with a fan or other devicepositioned within the electronic assembly 100 or within or proximate thethermal dissipation devices 120A and 120B. For example, the airflow canbe generated from a system fan. The airflow is directed in a pathwaythat is parallel to the PCBs 102 and 104 and power system 130. Airflow,however, is not limited to any particular direction. In someembodiments, for example, the airflow can be directed in a perpendiculardirection with respect to the PCB 102, PCB 104, power system 130, and/orheat-generating components 110. A primary airflow can thus be directedat, above, or below the PCBs 102 and 104, the heat-generating components110, the power system 130, and/or the thermal dissipation devices 120Aand 120B. Further, the primary airflow can be simultaneously directed toseveral different components/layers (such as the PCBs 102 and 104, theheat-generating components 110, the power system 130, and/or the thermaldissipation devices 120A, and 120B) or exclusively at individualcomponents/layers. Thus, the same airflow can be used to cool ordissipate heat simultaneously from multiple layers and/or components orsolely from a single layer and/or component.

The airflow can be utilized to assist or augment heat transfer ordissipation. In this regard, the electronic assembly 100 can utilize oneor both of heat conduction and/or an airflow pathway to dissipate heat.The combinations of heat conduction and airflow to dissipate heat arenumerous. By way of illustration, the thermal dissipation devices 120Aand 120B can directly contact the heat-generating components 110 and/orPCBs 102 and 104 to conduct heat away from these components. At the sametime, either or both thermal dissipation devices 120A and 120B couldgenerate or be exposed to an airflow that is directed at both the PCBs102, 104 and the thermal dissipation devices. For example, this airflowcould be utilized to cool the PCB 104 (including heat-generatingcomponents) and the thermal dissipation device 120A as the thermaldissipation device conducts and dissipates heat away from theheat-generating components 110. Thus, the same thermal dissipationdevice simultaneously dissipates heat away from PCBs 102 and 104 andheat-generating components 110.

The thermal dissipation devices can utilize and/or comprise a remoteheat exchanger (RHE). An RHE enables the thermal dissipation device tobe remote from the heat-generating device (such as PCB 104,heat-generating components 110, and/or power system 130). For example,heat can be transferred from the heat-generating device to an attachmentblock having a heat pipe. Further, the heat pipe can be integral to themodule or any portion of the electronic system (example, the thermaldissipation device) and extend outwardly from the electronic system to aremote heatsink. Alternatively, the heat pipe can attach to a surface ofthe module or system (example a surface of a thermal dissipation device)and then extend to a remote heatsink. The heat pipe, for instance, canbe a hollow copper pipe containing a fluid and wicking material. Througha process of vaporization and re-condensation, heat travels through theheat pipe to a heat exchanger, such as a finned heat sink. Localizedairflow can be used to evacuate the heat to the environment.

Looking to FIG. 1, one or both of the thermal dissipation devices 120Aand 120B could be or could utilize a cold-plate and/or could utilizeheat dissipation via heat pipes or liquids. The “In” and “Out” arrowssignify liquid-in and liquid-out, respectively. As such, the thermaldissipation devices 120A and 120B can be coupled to a pump and/or a heatexchanger to circulate a cooling liquid through the thermal solution tocool any one or combination of PCBs, heat-generating components, powersystem, etc. The thermal dissipation devices 120A and 120B can beutilized in conjunction with one or both of the heat conduction and/orairflow cooling techniques discussed herein. As one example, the thermaldissipation devices 120A and 120B can include a separate piece or uniton a top or bottom surface. This separate piece could be a liquid coldplate, evaporator, refrigerator, heatsink, or other device or technologyknown in the art.

Embodiments in accordance with the invention are not limited to anynumber or type of thermal dissipation devices. Further, the thermaldissipation devices 120A, 120B can be coupled together. For example, aliquid heat pipe (or other device known in the art) could extend fromthe thermal dissipation device 120A to the thermal dissipation device120B. This heat pipe would assist in removing heat from the thermaldissipation device 120A and heat-generating components 110 and transferthis heat to the thermal dissipation device 120B. Thereafter, thetransferred heat could be dissipated in a variety of ways discussedherein, including but not limited to use of air, liquid cold plates,additional heat pipes, heat dissipation, etc.

Various different electronic components, layers, and PCBs can becombined into different embodiments in accordance with the invention.FIGS. 4 and 5 illustrate one such exemplary embodiment as electronicassembly 400. In this figure, the processor circuit board can include(among other electrical components) at least one processor, memory, andASIC. For example, the processor circuit board can have numerouselectronic heat-generating components, such as plural processors, anASIC, and memory, to name a few examples. A first side of the processorcircuit board (example, the side including the heat generatingcomponents) is coupled, via a connector or connectors, to a systemboard. A first thermal dissipation device is disposed between the systemboard and the processor circuit board. This thermal dissipation devicecan dissipate heat away from both the heat generating components and thesystem board. A second side or back side of the processor circuit boardis coupled, via a connector or connectors, to a power circuit board. Asecond thermal dissipation device is disposed above the power circuitboard to dissipate heat away from the power circuit board. Further, thissecond thermal dissipation device can be coupled to the first thermaldissipation device to assist in heat transfer or heat dissipation.

As best shown in FIGS. 1 and 2, thermal dissipation devices 120A, 120Bcomprise a unitary or single member. Embodiments in accordance with theinvention, though, can utilize a wide variety of types and number ofthermal dissipation devices. For example, the thermal dissipationdevices 120A, 120B can comprise a plurality of individual, separatemembers. Some examples of various embodiments that can be utilized inconjunction with the electronic assembly 100 are shown in FIGS. 6A to6C. These examples illustrate a single airflow, but multiple airflowswith various directions are within embodiments in accordance with theinvention.

FIG. 6A shows a thermal dissipation device 600A having a plurality ofopenings 610A that extend through a body portion 620A. The openings 610Acan have a variety of configurations and/or shapes and include slots,holes, etc. and can be formed from adjacent pins, rods, fins, etc. Theopenings 610A enable an airflow (the airflow being into the page andindicated with a circle and “X”) to pass through the thermal dissipationdevice 600A.

FIG. 6B shows another example of a thermal dissipation device 600Bformed from a base component 602B and a plurality of other separatecomponents 604B. The base and separate components have a plurality ofopenings 610B. The openings 610B can have a variety of configurationsand/or shapes and include slots, holes, etc. and can be formed fromadjacent pins, rods, fins, etc. The openings 610B enable an airflow (theairflow being into the page and indicated with a circle and “X”) to passthrough the thermal dissipation device 600B.

FIG. 6C shows another example of a thermal dissipation device 600Cformed from a base component 602C and a plurality of other separatecomponents 604C. The base and separate components have a plurality ofopenings 610C. The separate components 604C are separate and removablefrom the base portion 602C and extend through holes or openings 640C inthe base portion 602C. The openings 610C can have a variety ofconfigurations and/or shapes and include slots, holes, etc. and can beformed from adjacent pins, rods, fins, etc. The openings 610C enable anairflow (the airflow being into the page and indicated with a circle and“X”) to pass through the thermal dissipation device 600C.

Embodiments in accordance with the present invention can utilize amodular connective architecture. If a particular electronic component(including PCBs) or device fails or otherwise needs to be replaced, theelectronic component can be removed from the module or the electronicassembly and replaced with a new and/or different component. As such,the electronic assemblies can be constructed with standardizedelectronic components and/or dimensions to enable flexibility andvariety of use and exchange of components. Looking to FIGS. 4 and 5 asan example, if the second thermal solution or power circuit board failsor needs to be replaced, the second thermal solution and the powercircuit board can be disconnected and/or removed from the electronicassembly while the processor circuit board and corresponding heatgenerating components remain connected to the system board. Thereafter,a new and/or different second thermal solution and/or power circuitboard can be connected to the electronic assembly. As such, expensiveheat-generating components (such as processors, memories, ASICs, etc.)can remain unchanged and do not need to be removed or replaced when thepower circuit board and/or second thermal solution are removed orreplaced. As another example, if the processor circuit board fails orneeds to be replaced, the processor circuit board and accompanying powercircuit board can be disconnected or uncoupled from the system board andremoved from the electronic assembly while the heat generatingcomponents remain connected to the processor circuit board. Thereafter,the first thermal solution could be repaired or replaced. Alternatively,a new and/or different processor circuit board and/or heat generatingcomponents could be repaired or replaced.

As used herein, the term “module” means a unit, package, or functionalassembly of electronic components for use with other electronicassemblies or electronic components. A module may be anindependently-operable unit that is part of a total or larger electronicstructure or device. Further, the module may be independentlyconnectable and independently removable from the total or largerelectronic structure.

The configuration or arrangement of electronic components, layers,and/or modules shown in the figures saves weight, space, and costs sincethe components and/or layers are efficiently spaced and additionalthermal dissipation devices are not required. For example, embodimentsin accordance with the present invention can utilize a variety ofmodules. Looking to FIGS. 1-3, the PCB 104 can be a processor module 192that includes heat-generating components 110 (such as plural separateprocessors, an ASIC, and memory all on the same board or card). Theprocessor module 192 may or may not include the thermal dissipationdevice 120A. As another example, the power system 130 can form a powersystem module 190 that may or may not include the thermal dissipationdevice 120B. The power system module 190 can vertically stack andconnect or coupled, via connectors 140, to the processor module.Together, the power system module, connector, processor module, andoptional thermal dissipation devices form a processor/power module 188that can be removably connected to, for example, the PCB 102. FIGS. 1-3,for example, show such a processor/power module connected, viaconnectors 106A and 106B, to PCB 102. Further, the power system 130and/or power module can provide a power source that is proximally closeto the load (example the PCB 104) in order to minimize noise andoptimize step load performance.

In one exemplary embodiment, the processor/power module 188 (FIG. 2) cancomprise two halves that mechanically and electrically connect or coupletogether. A first half includes the power system module, shown forexample as 190 in FIGS. 1 and 2. The power system module can include thepower system 130 with or without the thermal dissipation device 120B. Asecond half includes the processor module, shown for example as 192 inFIGS. 1 and 2. The processor module 192 includes the heat-generatingcomponents 110 and may or may not include the thermal dissipation device120A. In order to assemble the processor/power module 188, the firsthalf (i.e., the power system module 190) is coupled or connected to thesecond half (i.e., the processor module 192). Thereafter, theprocessor/processor module 188 is connected to the PCB 102. Variousconnectors can be used to couple the first and second halves togetherand to the PCB 102. As best shown in FIGS. 1-3, the power system 130 andthe PCB 104 are sandwiched between the thermal dissipation devices 120Aand 120B. Further, as shown, when the processor/power module isassembled, the heat-generating components 110 are positioned inside ahousing of the processor/power module itself, and the power system 130and the PCB 104 are positioned back-to-back.

The processor/power module can have various configurations. Forillustration purposes (as shown in FIGS. 1-3), the processor/powermodule has a general rectangular configuration. A top surface is formedfrom one outer surface of the power system 130 or, optionally, thethermal dissipation device 120B. A bottom surface is formed from oneouter surface of the thermal dissipation device 120A.

In order to facilitate modularity within the electronic assembly,various removable connections between electronic components can beutilized. By way of example, such connections include, but are notlimited to, land grid arrays (LGAs), pin grid arrays (PGAs), plugs(example, male), sockets (example, female), pins, connectors, soldering,or other removable or disconnectable attachments.

A module can include a variety of different heat exchanging or heattransferring interfaces (such as the interface between two thermaldissipation devices or the interface between a thermal dissipation and aPCB or a heat-generating component). These interfaces can be adapted toenhance heat conduction or heat exchange. For example, the interfacescan include conductive resins, tapes, adhesives, gap pads, greases, orany other device or compound that facilitates or improves heatconduction.

Embodiments in accordance with the invention can be utilized in a widevariety of different methods and embodiments. For example, embodimentsin accordance with the present invention can utilize embodiments taughtin U.S. patent application Ser. No. 10/800,837 filed Mar. 15, 2004,entitled “Multi-Processor Module” and incorporated herein by reference.As another example, an exemplary method can comprise connecting pluralheat-generating components to a first circuit board. The heat-generatingcomponents can include plural separate processors (example processorsformed on separate dies), ASICs, memories, and other devices. A powersystem can be connected in a vertical stacked-up configuration to thefirst circuit board. One or more power connectors can couple the powersystem to the first circuit board. A thermal dissipation device isdisposed above or along one surface of the power system, and anotherthermal dissipation device is disposed between the first circuit boardand a second circuit board. The thermal dissipation devices thermallydissipate heat away from both the first circuit board (including theheat-generating components), the power system, and the second circuitboard. The thermal dissipation device can simultaneously dissipate heat(for example via a direct heat exchange) from both the first circuitboard (including the heat-generating components) and the power system.Additionally, the thermal dissipation device can comprise, utilize, orgenerate a liquid exchange flow or a flow of air in an airflow pathway.The airflow pathway can be directed to any one of or any combination ofthe first and second circuit boards, the power system, the thermaldissipation devices, and/or the heat-generating components. Further, aliquid flow can be utilized to remove, dissipate, or transfer heat awayfrom PCBs, the thermal dissipation devices, the power system, orheat-generating components. Together, the power system, first circuitboard, thermal dissipation device, and heat-generating components form aprocessor/power module. This module can be connected to the secondcircuit board (such as a system board or motherboard) and arranged, forexample, in a vertically stacked-up configuration. The components withinthe processor/power module (such as the thermal dissipation devices, thePCB, the processors, the memory, the ASIC, and/or the power system) canbe individually or jointly repaired or replaced while other componentsand/or layers or the module remain mechanically and/or electricallycoupled to the second circuit board. The revised power/processor modulecan then be re-connected to the second circuit board.

One skilled in the art will appreciate that a discussion of variousmethods should not be construed as steps that must proceed in aparticular order. Additional steps may be added, some steps removed, orthe order of the steps altered or otherwise changed.

While the invention has been disclosed with respect to a limited numberof embodiments, those skilled in the art will appreciate, upon readingthis disclosure, numerous modifications and variations. It is intendedthat the appended claims cover such modifications and variations andfall within the true spirit and scope of the invention.

1. An electronic module removably connectable to a system board, theelectronic module comprising: a first portion connected to the systemboard and including a thermal dissipation device and a printed circuitboard (PCB) with a processor connected to a first side of the PCB, thethermal dissipation device extending between the processor and thesystem board; and a second portion connected on top of the firstportion, the second portion having a power system board for providingpower to the processor, the power system board extending adjacent andparallel to a second side of the PCB.
 2. The electronic module of claim1 wherein the thermal dissipation device forms one side of theelectronic module and the power system board forms an opposite side ofthe electronic module.
 3. The electronic module of claim 1 wherein thePCB includes a second processor connected to the first side of the PCB,and the thermal dissipation device extends between both processors andthe system board.
 4. The electronic module of claim 1 wherein thethermal dissipation device directly contacts the processor and thesystem board for dissipating heat directly away from the processor andthe system board.
 5. The electronic module of claim 1 further comprisinga second thermal dissipation device connected to the power system board,wherein the thermal dissipation device forms one side of the module andthe second thermal dissipation device forms another, opposite side ofthe module.
 6. The electronic module of claim 1 wherein the PCB has asecond side, opposite the first side, and the second side isback-to-back with one side of the power system board.
 7. The electronicmodule of claim 1 wherein heat generated by the processor is conducted,via a heat pipe, from the thermal dissipation device.
 8. The electronicmodule of claim 1 wherein the second portion is removable from the firstportion while the first portion remains connected to the system board.9. The electronic module of claim 1 wherein the thermal dissipationdevice substantially fills a volume of space formed underneath the firstside of the PCB.
 10. A method, comprising: connecting a first portion ofan electronic module to a printed circuit board (PCB), the first portionhaving a thermal dissipation device and a processor board with pluralprocessors; connecting a second portion of the electronic module on lopof the first portion so a power board in the second portion isback-to-back with the processor board; dissipating heat away from theplural processors with the thermal dissipation device; and dissipatingheat, with the thermal dissipation device, from the PCB and from otherheat-generating components on the processor board.
 11. The method ofclaim 10 further comprising dissipating heat from the thermaldissipation device using liquid heat exchange.
 12. The method of claim10 further comprising dissipating the heat from the first portion usinga liquid cold plate.
 13. The method of claim 10 further comprisingdisconnecting the second portion from the first portion while the firstportion remains connected to the PCB.
 14. The method o:f claim 10further comprising: providing DC power from the second portion to thefirst portion; providing processing functionality from the first portionto the PCB; dissipating heat from the first and second portions with thethermal dissipation device.
 15. A method, comprising: connecting a firstportion of an electronic module to a printed circuit board (PCB), thefirst portion having a thermal dissipation device and a processor boardwith plural processors; connecting a second portion of the electronicmodule on top of the first portion so a power board in the secondportion is back-to-back with the processor board; dissipating heat awayfrom the plural processors with the thermal dissipation device; anddissipating heat away from the power board with another thermaldissipation device.
 16. An electronic module connectable to a systemboard, the electronic module, comprising: a circuit board having atleast one processor and memory; a power board coupled, to form avertically stacked-up configuration, to the circuit board for providingpower to the circuit board; and a thermal dissipation device disposedbetween the circuit board and the system board, wherein the thermaldissipation device contacts the processor for dissipating heat away fromthe processor.
 17. The electronic module of claim 16 wherein the thermaldissipation device substantially fills a volume of space between thecircuit board and the system board.
 18. The electronic module of claim16 wherein: the electronic module has a rectangular configuration; thethermal dissipation device forms a first side of the electronic module;the power board forms a second side, opposite the first side, of theelectronic module; the thermal dissipation device dissipates heat, via adirect heat exchange, away from both the processor and the system board.19. The electronic module of claim 16 further comprising a secondthermal dissipation device coupled, to form a vertically stacked-upconfiguration, to the power board.